HP BladeSystem c3000 Technology Brief

Manufacturer
Type
Pages 28 Pages
Updated Sep 3, 2021
Category Enclosure

Table of Contents

  • Abstract

    2
  • HP Thermal Logic technologies

    4
  • Active Cool fans

    5
  • HP PARSEC architecture

    6
  • Thermal Logic for the server blade and enclosure

    7
  • Power supplies and enclosure power subsystem

    8
  • HP BladeSystem Power Sizer

    9
  • Pooled power

    10
  • Dynamic Power Saver mode

    11
  • Interconnect options and infrastructure

    12
  • Fabric connectivity and port mapping

    13
  • Virtual Connect

    16
  • Enclosure-based DVD ROM

    17
  • Insight Display

    19
  • Command-line interface

    20
  • Recommendations

    21
  • Appendix A. Acronyms in text

    22
  • Appendix B. Fan, power supply, and device bay population guidelines

    23
  • For more information

    28

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